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Don Y <blockedofcourse@foo.invalid> writes:
>>>
If you are using perfboard, you will be constrained as to the locations
and placements of devices (based on the "holes"). If you can stick
with DIP packages, this could be OK. SMT might be a stretch to fabricate
like this (esp if you didn't want to be forever "patching" it)
>
The first analog computer used just DIP and through-hole components. I'm
open-minded at this point on DIP vs SMT but I don't really know how to
prototype with SMT components and the stuff I've read
scratching/drilling divides into copper boards doesn't sound very
practical.
But maybe I should try something new. Copper-clad perfboard
sounds like it might be a practical, inexpensive approach.
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