Sujet : Re: BAW
De : bill.sloman (at) *nospam* ieee.org (Bill Sloman)
Groupes : sci.electronics.designDate : 22. Jan 2025, 05:30:48
Autres entêtes
Organisation : A noiseless patient Spider
Message-ID : <vmps9t$oh3j$1@dont-email.me>
References : 1 2 3 4 5
User-Agent : Mozilla Thunderbird
On 22/01/2025 10:52 am, Buzz McCool wrote:
On 1/21/2025 10:56 AM, john larkin wrote:
>
This has got to crush the XO business. It looks like it's a single
chip that's encapsulated like any other IC. XOs are complex and need
hermetic cans.
XOs used to use handmounted crystals. There's nothing all that complicated about them, but low volume manufacture tends to be a bit knife and fork.
Looking through this BAW app note
https://www.ti.com/lit/an/snaa362/snaa362.pdf, I couldn't tell BAW devices would work at high altitude or in a vacuum. I have to ask because the "acoustic" in the name makes me want to make sure that some sort of atmosphere isn't needed.
As far as I can see these are surface acoustic wave devices. Integrated circuits are pretty well encapsulated. This one probably dumps any heat it generates into the board it is mounted on, which might run a bit warmer in a vacuum, but that would be the only risk I can see.
-- Bill Sloman, Sydney
BAW
Re: BAW