Re: Removing glued SMDs

On 1/29/2025 4:41 AM, HW wrote:

On some boards, the SMD components are glued down prior to wave
soldering.
 What is the best method for removing these parts, preferably without
damage?

Most of the adhesives used for this soften at solder-melting temperatures, so the parts can be fairly easily removed with hot air.
For large components, or less heat-sensitive underfill materials (I'm looking at you, Apple...) some scavengers have had success using a mill to grind away the PCB (for scavenging the part from a scrap board) or the part itself (for removing a failed part to replace it).  Obviously, it's important to get the PCB exactly level to the milling plane, and precise depth control is critical.
--
I'm part of the vast libertarian conspiracy to take over the world and leave everyone alone.